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Title:
CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JP2011111500
Kind Code:
A
Abstract:

To provide a curable composition having an excellent physical properties especially having an excellent elongation rate and a modulus after curing, also reducing the specific gravity of the whole of the composition and used as a sealing material.

This curable composition is provided by containing a hydrolyzable silyl group-containing polymer having 40 to 80% silylation rate and micro-balloons, and having a ≤1.10 specific gravity of the whole composition.


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Inventors:
NAKANISHI GUN
ITO MASAHIRO
Application Number:
JP2009267795A
Publication Date:
June 09, 2011
Filing Date:
November 25, 2009
Export Citation:
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Assignee:
SUNSTAR ENGINEERING INC
International Classes:
C08L101/10; C08K7/22; C08L71/00
Domestic Patent References:
JP2007320998A2007-12-13
JPH11189721A1999-07-13
JP2009197177A2009-09-03
JP2005082681A2005-03-31
JP2008297480A2008-12-11
JP2006096859A2006-04-13
JP2007016129A2007-01-25
Attorney, Agent or Firm:
Mitsuo Tanaka
Takuji Yamada
Kenichi Morizumi
Yasuo Shibata



 
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