To provide a curable epoxy resin composition capable of forming a cured material having high heat resistance, light fastness and heat impact resistance, and especially excellent in moisture absorption resistant reflow properties.

A curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) expressed by formula (1) [wherein R¹ and R² are each H or 1-8C alkyl] and a polycarbodiimide resin (C). In the curable epoxy resin composition, the alicyclic epoxy compound (A) is desirably a compound having a cyclohexene oxide group.