Title:
CURABLE RESIN COMPOSITION EXCELLENT IN TORSION ADHESION STRENGTH AND ROOM-TEMPERATURE CURABLE ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2009269997
Kind Code:
A
Abstract:
To provide a curable silicone resin composition developing significantly high adhesion strength in a torsion direction.
The curable resin composition contains a curable silicone resin (A) having a crosslinkable reactive silicon group in the molecule and a curing catalyst (B), wherein a rate of the content of silicon atoms derived from the reactive silicon group in the curable silicone resin (A) with respect to the curable silicone resin (A) is from 1.0 to 10.0 mass%.
Inventors:
NOMURA YUKIHIRO
INOUE MAI
SATO SHINICHI
INOUE MAI
SATO SHINICHI
Application Number:
JP2008121509A
Publication Date:
November 19, 2009
Filing Date:
May 07, 2008
Export Citation:
Assignee:
KONISHI CO LTD
International Classes:
C08L101/10; C08K3/00; C08K5/541; C08K5/544; C08L43/00; C09J11/06; C09J143/04; C09J171/02; C09J183/02; C09J183/04; C09J183/07; C09J201/10
Domestic Patent References:
| JPS5978223A | 1984-05-07 | |||
| JPS604576A | 1985-01-11 | |||
| JPS6137839A | 1986-02-22 | |||
| JP2001049113A | 2001-02-20 | |||
| JP2005213445A | 2005-08-11 |
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