Title:
硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP7374270
Kind Code:
B2
Abstract:
The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.
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Inventors:
Taro Shioshima
Kenichiro Sato
Hidehiro Deguchi
Eisuke Ishizawa
Munehiro Hatai
Norishige Shichiri
Kenichiro Sato
Hidehiro Deguchi
Eisuke Ishizawa
Munehiro Hatai
Norishige Shichiri
Application Number:
JP2022140717A
Publication Date:
November 06, 2023
Filing Date:
September 05, 2022
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01L21/60; B32B7/025; C08G77/04; C08G77/44; C08L83/10; H01L21/02; H01L21/312; H01L21/768; H01L23/532; H01L25/065; H01L25/07; H01L25/18; H01L27/146
Domestic Patent References:
| JP2013038112A | ||||
| JP2010116462A |
Foreign References:
| US20160268230 |
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus