Title:
硬化性シリコーン組成物、導電性シリコーン粘着剤、これらの製造及び使用方法、並びにこれらを含有する電気デバイス
Document Type and Number:
Japanese Patent JP6416188
Kind Code:
B2
Abstract:
A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.
Inventors:
John Arbor
Brian Sislea
Adriana Zamboba
Brian Sislea
Adriana Zamboba
Application Number:
JP2016501762A
Publication Date:
October 31, 2018
Filing Date:
March 13, 2014
Export Citation:
Assignee:
Dow Silicones Corporation
International Classes:
C09J183/04; C08K3/08; C08K5/01; C08L83/05; C08L83/07; C09J9/02; C09J11/04; H01B1/00; H01B1/22
Domestic Patent References:
| JP2004533501A | ||||
| JP2004165357A |
Foreign References:
| CN101381592A | ||||
| CN102585758A | ||||
| CN102277128A | ||||
| KR1020130015544A | ||||
| WO2012022011A1 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Shinya Mitsuhiro