To provide a curable silicone resin composition showing excellent adhesiveness to a hardly-adhesive substrate such as a polyphthalamide resin, and useful as an adhesive, a sealing agent and the like.

The curable silicone resin composition contains: an organopolysiloxane (a) having at least two carbon-carbon double bonds reactive with a SiH group in one molecule; an organohydrogenpolysiloxane (b) having at least two SiH groups in one molecule; an addition reaction catalyst (c); an epoxy group-containing compound (d); and a latent amino compound (e).