Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOISTURE-CURABLE REACTIVE HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP2011225636
Kind Code:
A
Abstract:

To provide a moisture-curable reactive hot-melt adhesive having a long tack-free period while showing high initial adhesion strength, and having excellent workability.

The moisture-curable reactive hot-melt adhesive contains an isocyanate-terminated urethane prepolymer obtained by reacting a polyol composition with a polyfunctional isocyanate compound, and a urethane (meth)acrylate compound.


Inventors:
KOBAYASHI MASARU
Application Number:
JP2010093775A
Publication Date:
November 10, 2011
Filing Date:
April 15, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AICA KOGYO CO LTD
International Classes:
C09J175/04; C09J175/16