Title:
CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2021079490
Kind Code:
A
Abstract:
To provide a cutting device which prevents damages on a wafer and a cutting blade.SOLUTION: Cutting means 6 includes a rotary shaft 16, a housing 18 which rotatably supports the rotary shaft 16, and a mount 22 which is formed on a tip end of the rotary shaft 16 and holds a cutting blade 20. The mount 22 includes a boss part 34 which is inserted into an opening 30a formed in a center of the cutting blade 20, a ring-shaped support part 36 which is formed on an outer circumference of the boss part 34, and exposes and supports a cutting edge 32 of the cutting blade 20, a suction hole 40 which is opened between the boss part 34 and the support part 36 and sucks and holds the cutting blade 20, and a communication passage 44 which communicates the suction hole 40 to a suction source 42. A pressure gauge 46 is arranged on the communication passage 44. A cutting device includes control means 50 which prevents rotation start of the rotary shaft 16 when a value measured by the pressure gauge 46 does not reach an allowance, and allows the rotation start of the rotary shaft 16 when the value measured by the pressure gauge 46 reaches the allowance.SELECTED DRAWING: Figure 3
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Inventors:
NITTA HIDEJI
YUZAWA HARUNOBU
MATSUSHITA YOSHIO
YUZAWA HARUNOBU
MATSUSHITA YOSHIO
Application Number:
JP2019208983A
Publication Date:
May 27, 2021
Filing Date:
November 19, 2019
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B49/08; B24B27/06; B24B45/00; H01L21/301
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko