To provide a cylindrical grinder which can easily perform centering, and surely prevent the positional displacement of an ingot to improve machining accuracy, and a method for cylindrically grinding the ingot.
A cylindrical grinder B includes a support unit 10 equipped with a pair of support devices 12, 13, in which an ingot 1 of a silicon crystal is gripped in a direction of an axis line O1 and clamped and held to be rotated around the axis line O1, and a grinding unit 11 that relatively moves along the direction of the axis line O1 of the ingot 1 to traverse-grind an outer circumference of the ingot 1. The support unit 10 is constituted so that one support device 13 is disposed at an upper position and the other support device 12 is at a lower position, and the ingot 1 is clamped and held in such a state that the direction of the axis line O1 of the ingot 1 is directed to a vertical direction T2.
| JP2009190142A | 2009-08-27 |
Tadashi Takahashi
Yasuhiko Murayama