Title:
DAM-BAR WORKING APPARATUS OF SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP2818092
Kind Code:
B2
Abstract:
PURPOSE: To surely remove dam dars even when the pitch and the width of the dam bars are irregular and to remove the dam bars which are situated at equal distances from both start end parts and finish end parts of the dam bars by a method wherein a semiconductor device is moved back and forth, the semiconductor device is irradiated with a laser beam at its advance route and its return route and the dam bars are removed.
CONSTITUTION: A semiconductor device is moved back and forth, dam bars 23 which couple a lead frame for the semiconductor device are irradiated with a laser beam from a working head in its advance route and its return route, and the dam bars 23 are removed. In addition, e.g. in the advance route, parts around positions (a) at a prescribed distance L from start end parts of the dam bars along the advance-route direction are irradiated with the laser beam, and the dam bars 23 are removed. In addition, in the return route, parts around positions (b) at the prescribed distance L from the start end parts of the dam bars 23 along the return-route direction are irradiated with the laser beam, and the dam bars 23 are removed. Thereby, even when the dam bars are wide, the dam bars can be removed in positions at the prescribed distance L from both end parts.
Inventors:
Naoki Takeshi
Nobuhiko Tada
Yoshiaki Shimomura
Shigeyuki Sakurai
Yoshiya Nagano
Nobuhiko Tada
Yoshiaki Shimomura
Shigeyuki Sakurai
Yoshiya Nagano
Application Number:
JP5268293A
Publication Date:
October 30, 1998
Filing Date:
March 12, 1993
Export Citation:
Assignee:
Hitachi Construction Machinery Co., Ltd.
International Classes:
B23K26/08; B23K26/00; H01L23/50; (IPC1-7): H01L23/50; B23K26/00
Attorney, Agent or Firm:
Takasaki Takahiro
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