To provide a damping composition suitable for damping material uses, which is excellent in damping properties at high temperatures (60-80°C), has satisfactory workability at room temperature (about 20°C), and can be easily produced.

The damping composition includes 80 mass% or more of a resin component (A) and an inorganic filler component (B) in total. The ratio of resin (α) in the resin component (A) is 30-70 mass%, and the ratio of resin (β) in the resin component (A) is 30-70 mass%. The resin (α) is composed of xylene resin having an OH value of 18 (mgKOH/g) or less, and the resin (β) is composed of one selected from ethylene ethyl acrylate copolymer (EEA), ethylene methyl acrylate copolymer (EMA), ethylene butyl acrylate copolymer (EBA), ethylene vinyl acetate copolymer (EVA), and olefinic elastomer, or a combination of two or more thereof.