Title:
DEPOSITION CHAMBER
Document Type and Number:
Japanese Patent JPH09181065
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve the uniformity of the thickness of a deposit by adding a second gas distributor, and installing it at a distance from the center of a substrate supporting surface so that it will be positioned almost directly above the center of the substrate supporting surface. SOLUTION: A center nozzle 56 connecting to a second gas source through a second gas controller and a second gas supply line 62, is added. The center nozzle 56 has an orifice 64 the center of which is positioned above a substrate supporting surface 16. The orifice 64 is placed so that the distance between it and the substrate supporting surface 16 will be at least two times the distance between the orifice 38 of a nozzle 34 and the substrate supporting surface. Use of the center nozzle 56 allows variation in deposit thickness to be adjusted to an exemplary one. The pressure at which process gas supplied to a common manifold is supplied to the individual gas distributors is equalized. This improves the uniformity of the thickness of a deposit.
Inventors:
SHIJIYAN RI
FURETSUDO SHII REDEKAA
ISHIKAWA TETSUYA
FURETSUDO SHII REDEKAA
ISHIKAWA TETSUYA
Application Number:
JP31389896A
Publication Date:
July 11, 1997
Filing Date:
November 25, 1996
Export Citation:
Assignee:
APPLIED MATERIALS INC
International Classes:
C23C16/44; C23C16/455; C23C16/507; C23C16/509; C23C16/517; C23C16/52; H01J37/32; H01L21/205; H01L21/31; C23C16/50; (IPC1-7): H01L21/31; C23C16/44; C23C16/52; H01L21/205
Attorney, Agent or Firm:
Yoshiki Hasegawa (3 outside)