Title:
DEVICE FOR APPLYING ELECTRICAL CONDUCTOR PATTERN TO SUBSTRATE
Document Type and Number:
Japanese Patent JP2022163017
Kind Code:
A
Abstract:
To provide a device for transferring, from the surface of a flexible web to the surface of a substrate, a pattern of a composition containing electrically conductive material particles and a thermally activated adhesive.SOLUTION: A device includes: drive mechanisms for advancing webs 14a, 14b and a substrate 10 at the same time, through a nip 40 that acts such that pressure rollers 22a, 22b press the surfaces of the webs and the surface of the substrate against each other; a heating station (a heater 52, a hot plate or a pressure roller) for heating at least one of the substrate and the webs to a temperature at which an adhesive in a composition is activated before or during passage through the nip; a cooling station 23 for cooling the webs, after the passage through the nip; and a separation device 30 for, after passage through the cooling station, peeling the webs from the substrate to leave a pattern of the composition adhering to the surface of the substrate.SELECTED DRAWING: Figure 1
Inventors:
Benzion Randa
Heim Tuito
Stanislav Sigelbalm
Naomi Elfacy
Heim Tuito
Stanislav Sigelbalm
Naomi Elfacy
Application Number:
JP2022111553A
Publication Date:
October 25, 2022
Filing Date:
July 12, 2022
Export Citation:
Assignee:
Lumet Technologies Limited
International Classes:
H05K3/12; B41F16/00; H05K3/20
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Yoshiaki Irobe
Mitsutsugu Sugimura
Yoshiaki Irobe
Previous Patent: JPWO2022163016
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