Title:
DEVICE CHIP PEELING METHOD AND PEELING DEVICE
Document Type and Number:
Japanese Patent JP2022065260
Kind Code:
A
Abstract:
To drop a package from a temperature-sensitive adhesive tape more reliably when the temperature-sensitive adhesive tape is used.SOLUTION: In a chip peeling method that peels each chip from a protective tape in a state where a workpiece with the protective tape attached on the back side is divided into multiple chips, the protective tape is a temperature-sensitive adhesive tape whose adhesive strength is reduced by heating or cooling, and the chip peeling method includes a holding step of sucking and holding the other side of a workpiece unit, which is located on the side opposite to the one side of the protective tape to which the multiple chips are attached by the holding surface of the holding table, an adhesive force reduction step of reducing the adhesive force of the protective tape by changing the temperature of the protective tape with a temperature control mechanism provided on the holding table, and a storage step of storing the multiple chips in a container located below the holding table by dropping the multiple chips from the protective tape while sweeping the multiple chips with a sweeper.SELECTED DRAWING: Figure 4
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Inventors:
TAKAHASHI MASAYUKI
Application Number:
JP2020173690A
Publication Date:
April 27, 2022
Filing Date:
October 15, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/67; H01L21/301
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato