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Patent Searching and Data


Title:
DEVICE FOR FIXING BOARD-MOUNTED PART
Document Type and Number:
Japanese Patent JPH06152116
Kind Code:
A
Abstract:

PURPOSE: To realize board mounting of a tall part where it can be fixed to a printed board while keeping the height of horizontally-mounted part to be constant, its workability is excellent, and part removal and modification of the printed board can be easily made.

CONSTITUTION: The leads 3 of a tall part 2 are bent to decrease the height of the part. An auxulliary metal 12 is prepared as a fixing member and a through-hole 12a is made in the metal 12, then a part body 2a is placed through the hole 12. A through-hole 13 is formed in a printed wiring board 11 and the metal 12 is soldered to the hole 13 to fix the part body. It is possible to fix the metal 12 at the same time when solder-dipping the part leads, & thereby keeping the height of horizontally-mounted part to be constant and carrying out fitting easily. In comparison with the fitting work by using adhesive, the working time can be saved and the flow of the production line also become smooth, therefore controlling steps and working processes will be reduced, high-quality and stable products can be supplied, and it is suitable for fixing the package mounting part.


Inventors:
ARAI SUSUMU
FUKADA SHIGEMI
Application Number:
JP30531292A
Publication Date:
May 31, 1994
Filing Date:
November 16, 1992
Export Citation:
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Assignee:
HASEGAWA ELECTRIC CO LTD
International Classes:
H05K1/18; H05K3/34; H05K13/04; H05K3/30; (IPC1-7): H05K3/34; H05K1/18; H05K13/04
Attorney, Agent or Firm:
Akihide Sugimura (5 outside)