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Title:
DEVICE, PROGRAM AND METHOD FOR PREDICTING LASER BENDING
Document Type and Number:
Japanese Patent JP2007075885
Kind Code:
A
Abstract:

To provide a device, a program and a method for predicting laser bending capable of predicting the result of the bending by laser beams while any actual work is not present.

The laser bending predicting device for predicting the result of the bending by laser beams comprises a bending condition acquisition unit 1 for acquiring the bending condition, an analysis model preparation unit 3 for preparing an analysis model based on the bending condition acquired by the bending condition acquisition unit 1, and an analysis unit 5 for calculating the result of analysis of the bending by performing the heat transfer analysis and the thermal stress analysis based on the analysis model prepared by the analysis model preparation unit 3.


Inventors:
TATENO TADASHI
Application Number:
JP2005270656A
Publication Date:
March 29, 2007
Filing Date:
September 16, 2005
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
B21D11/20; B23K26/00; G06F19/00
Domestic Patent References:
JP2002192240A2002-07-10
JP2004082161A2004-03-18
JP2002334120A2002-11-22
JP2002099579A2002-04-05
JP2002082999A2002-03-22
Attorney, Agent or Firm:
Hideo Akazawa