ダイヤモンド接合体及びダイヤモンド接合体の製造方法

Title:

ダイヤモンド接合体及びダイヤモンド接合体の製造方法

Document Type and Number:

Japanese Patent JP7120524

Kind Code:

B2

Abstract:

A diamond joined body is a diamond joined body including a hard substrate and a polycrystalline diamond layer arranged on the hard substrate, wherein an area ratio of carbon grains in a region of the hard substrate is less than 0.03%, the region being a region enclosed by an interface between the hard substrate and the polycrystalline diamond layer and an imaginary line x in a cross section parallel to a normal direction of the interface, the imaginary line x being parallel to the interface on the hard substrate side and having a distance of 500 µm from the interface.

More Like This:

WO/2014/104587	POLYCRYSTALLINE DIAMOND COMPACT HAVING CUTTING SURFACE DISTINCTION MARK
JP2012206223	SURFACE COATED CUTTING TOOL WITH HARD COATING LAYER EXHIBITING EXCELLENT CHIPPING RESISTANCE, FRACTURE RESISTANCE, AND PEELING RESISTANCE
WO/2018/070195	SURFACE-COATED CUTTING TOOL

Inventors:

Daisetsu Iwasaki
Lee Jin-young
Yamaguchi Tadashi
Shinichiro Maki

Application Number:

JP2020525275A

Publication Date:

August 17, 2022

Filing Date:

March 27, 2019

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Sumitomo Electric Hardmetal Corp.

International Classes:

B23B27/14; B23B27/20; B32B9/00; B32B18/00

Domestic Patent References:

JP61109628A
JP2012530188A
JP2016087726A
JP2017039954A
JP2017064840A
JP2018158400A

Foreign References:

US20150298292
US20170067294
US20170183267
WO2016175088A1

Attorney, Agent or Firm:

Patent Attorney Fukami Patent Office

Previous Patent: Method for producing water treatment separation membrane and water treatment separation membrane pro...

Next Patent: METHOD FOR TIME CALIBRATION OF DEFECTIVE POSITION DIRECTION LOCATING SYSTEM FOR POWER TRANSMISSION L...