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Patent Searching and Data


Title:
DIAMOND SAW BLADE AND PRODUCTION OF DIAMOND WHETSTONE USED FOR IT
Document Type and Number:
Japanese Patent JPH11309711
Kind Code:
A
Abstract:

To ensure strength of a chip main body and to improve durability while excellent sharpness is kept by embedding a filling material into at least one slit provided along the circumferential direction of an integrally bonded diamond whetstone on the apex of a metal base.

A diamond whetstone is formed on the apex of teeth 4a of a metal base 4 through a substrate layer 3 and a slit 2 provided on a mixed layer 1 of diamond abrasive grain and a bond for forming a whetstone and a filling material 5 embedded therein reinforce a thin part to hold necessary strength of the whole and to prevent the whetstone part from being broken or cracked. The edge area of the whetstone is decreased to obtain high cutting speed and stable whetstone life in parallel and the filling material 5 is gradually abraded during cutting and the apex of the embedded part of the filling material 5 is kept into a little recessed shape from the apex face of the whetstone and the edge part of the slit 2 and the abrasive grain projected from the surface of the edge of the mixed layer 1 of the bond and the diamond abrasive grain effectively bite a material to be cut and guarantee excellent sharpness for a long time.


Inventors:
YOSHIDA TAKUMA
KAGOHASHI WATARU
KOBAYASHI MOKICHI
Application Number:
JP12061798A
Publication Date:
November 09, 1999
Filing Date:
April 30, 1998
Export Citation:
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Assignee:
TOHO TITANIUM CO LTD
SANKYO DIAMOND KOGYO KK
International Classes:
B24D3/00; B24D3/06; B24D5/12; B24D5/14; B28D1/24; (IPC1-7): B28D1/24; B24D3/00; B24D3/06; B24D5/12; B24D5/14
Attorney, Agent or Firm:
Kenji Akatsuka (1 outside)