Title:
DICING EQUIPMENT
Document Type and Number:
Japanese Patent JP3275303
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a dicing equipment, which evacuates vacuum lines for suction pad, etc., that holds a wafer by suction to a vacuum with and ejector and is, capable of reducing the total air consumption of a factory and satisfactorily evacuating water flowed from vacuum lines, by effectively activating an ejector and suitably discharging water which flows from the vacuum lines.
SOLUTION: Each of plural vacuum lines 100 is not provided with an independent ejector, but a tank T1 is connected to plural vacuum lines 100 and is evacuated to a vacuum by an ejector E2 via a tank T2. Also, water flowing from the vacuum lines 100 is stored in the tank T2, and when the volume of the stored water reaches a predetermined volume, the tank T1 is shut off from the tank T2 by a valve V4 and the tank T2 is made to communicate with an air source 102 by a valve V2, to discharge the water stored in the thank T2 via a check valve 104.
Inventors:
Tomohiro Suzuki
Application Number:
JP33410998A
Publication Date:
April 15, 2002
Filing Date:
November 25, 1998
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
H01L21/301; (IPC1-7): H01L21/301
Domestic Patent References:
| JP6106474A | ||||
| JP4150911A | ||||
| JP7171534A | ||||
| JP195599U |
Attorney, Agent or Firm:
Kenzo Matsuura
Previous Patent: LYING POSTUROGRAPH
Next Patent: TREATMENT METHOD OF DECORATIVE VENEER AND MANUFACTURE OF LIGNEOUS MATERIAL
Next Patent: TREATMENT METHOD OF DECORATIVE VENEER AND MANUFACTURE OF LIGNEOUS MATERIAL