PURPOSE: To prevent operation of a dicing system itself from becoming even when a branch line conveying passage becomes defective by combining a plurality of dicing units under the control of a CPU, a conveying route to become a master line, and a branch line conveying passage for connecting the route to dicing units.
CONSTITUTION: A frame F which places a wafer W is delivered to a conveying route by conveying means 6, and when it is conveyed to a predetermined position of a predetermined dicing unit, the frame F is picked up by a wafer supply and return means 9, slid to be supplied to the dicing unit 1, processed as prescribed, then returned to the route by returning of the means 9, and conveyed to next step. Thus, even if a supply mechanism to the dicing unit is troubled, it is separated from a dicing system, and can be solely used. Accordingly, an operating efficiency can be improved, and a trouble position can be inspected and repaired during operating.
| JPS5815067 | [Title of the device] New product |
| JPH03287383 | DICING SAW |
| JPS63319110 | PELLETIZING DEVICE OF SEMICONDUCTOR WAFER |
UCHIDA FUMIO
TAKAHASHI TOSHIAKI
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