Title:
DICING TAPE AND DICING DIE-BONDING FILM
Document Type and Number:
Japanese Patent JP2022095302
Kind Code:
A
Abstract:
To provide a dicing tape that suppresses the floating of a die-bonding film from an adhesive tape, ensures a sufficient kerf width, and exhibits good pick-up performance, in a manufacturing step of a semiconductor wafer at low temperatures and a dicing die-bonding film provided with the die-bonding film peelable.SOLUTION: The dicing tape includes a base film and an adhesive layer. The base film includes a polyamide resin and a resin including an ionomer of an ethylene-unsaturated carboxylic acid copolymer. The adhesive layer is composed of an adhesive composition including an acrylic adhesive polymer having an active energy ray reactive carbon-carbon double bond and a hydroxyl group, a photopolymerization initiator, and a polyisocyanate crosslinking agent for cross-linking with the hydroxyl group.SELECTED DRAWING: Figure 2
Inventors:
TSUNODA TOSHIYUKI
FURUKAWA KEI
SATO HIROKAZU
TANAKA RIE
MASUDA AKIYOSHI
FURUKAWA KEI
SATO HIROKAZU
TANAKA RIE
MASUDA AKIYOSHI
Application Number:
JP2020208544A
Publication Date:
June 28, 2022
Filing Date:
December 16, 2020
Export Citation:
Assignee:
MAXELL LTD
International Classes:
H01L21/301; C09J7/24; C09J7/25; C09J7/38; C09J11/04; C09J11/06; C09J133/00; C09J161/04; C09J163/00; C09J175/04; H01L21/52
Attorney, Agent or Firm:
Michiko Matsutani
Nishishita Shoishi
Nishishita Shoishi
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