Title:
DIE SORTER TAPE
Document Type and Number:
Japanese Patent JPH05343517
Kind Code:
A
Abstract:
PURPOSE: To prevent that a flaw and a crack are caused in a pellet due to a push-up needle when it is sorted after a dicing operation by a method wherein a cutout part (an opening) is formed in a film on the side on which a wafer is pasted.
CONSTITUTION: In a die sorter tape 8, a film 2 is coated with an adhesive which is used to fix a wafer which is diced in units of pellets. On the tape, cutout parts 11 (openings) are made on the face which is faced with positions to be pushed up by means of a push-up needle in the film 2. The force required for the push-up needle can be reduced.
Inventors:
SAITO TETSUYA
SAWAMOTO SHINICHI
SAWAMOTO SHINICHI
Application Number:
JP14974392A
Publication Date:
December 24, 1993
Filing Date:
June 10, 1992
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/78
Attorney, Agent or Firm:
Yamato Tsutsui