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Title:
DIELECTRIC PASTE AND DIELECTRIC FILM OBTAINED THEREFROM
Document Type and Number:
Japanese Patent JP2000080271
Kind Code:
A
Abstract:

To obtain the subject paste capable of being easily coated and having a low viscosity even with a high solid ratio by bringing the paste to contain dielectric powder in a specific polyimide precursor varnish.

The objective paste is obtained by bringing 100 pts.wt. of (A) a polyimide precursor varnish obtained by dissolving 5-80 wt.% of a mixture, which constitutes a polyimide precursor, of (i) a diamine expressed by formula I [R1 and R2 are each formula II or the like, formula III or the like; R3 and R4 are each H or a 1-5C alkyl; (m) is 0-10] with (ii) a tetracarboxylic acid (ester) expressed by formula IV (R5 to R8 are each H or a 1-5C alkyl) to contain preferably 0.5-200 pts.wt., more preferably 10-150 pts.wt. of (B) dielectric powder having preferably 0.05-10 μm. The blended amount of the ingredient (i) in 100 pts.wt. of the mixture of the ingredient (i) with the ingredient (ii) is preferably 20-99 pts.wt. As the ingredient B, barium titanate, strontium titanate, etc., are cited.


Inventors:
KISHIMOTO SOICHIRO
SETO KEITARO
IMAMURA SHIGEKI
ECHIGO YOSHIAKI
Application Number:
JP25093298A
Publication Date:
March 21, 2000
Filing Date:
September 04, 1998
Export Citation:
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Assignee:
UNITIKA LTD
International Classes:
C08K3/22; C08K3/24; C08L79/08; C09D5/25; C09D179/08; (IPC1-7): C08L79/08; C08K3/22; C08K3/24; C09D5/25; C09D179/08