ELECTRONIC PART-SEALING RESIN COMPOSITION, PRODUCTION THEREOF AND SEALED ELECTRONIC PART BY USING THE SAME COMPOSITION

Japanese Patent JP2000080274

A

To obtain an electronic part-sealing resin composition excellent in reliability to the humidity resistance and molding properties.

This electronic part-sealing resin composition consists of (A) a linear chain type polyarylene sulfide resin, (B) an inorganic ion-exchanging material, (C) a graft copolymer obtained by chemically bonding (a) at least one of an olefinic polymer segment consisting of an α-olefin, an alkyl ester of an α,β-unsaturated acid and maleic anhydride or the α-olefin and the alkyl ester of an α,β-unsaturated acid, with (b) a polymer segment consisting of succinic anhydride unit having an unsaturated group shown by the following general formula in a branching or cross-linking structure (provided that R1 and R2 in the formula are each an alkyl group or hydrogen atom and the total number of carbon atoms in the R1 and R2 is 6-17) and (D) an inorganic filler.

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YAMAMOTO HIROSHI
HASHIMOTO SHINJI
OTSU MASAAKI

JP25129098A

March 21, 2000

September 04, 1998

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MATSUSHITA ELECTRIC WORKS LTD

C08K3/18; C08K3/36; C08K7/14; C08L51/06; C08L81/02; (IPC1-7): C08L81/02; C08K3/18; C08K3/36; C08K7/14; C08L51/06

Keisei Nishikawa (1 person outside)

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