To provide a dielectric resin material satisfactorily having mechanical characteristics suitable for a circuit member, especially for a millimeter-wave device which is used in a frequency band of ≥50 GHz, and to provide the circuit member.

This dielectric resin material is used for the circuit member which utilizes electrical radiation of a frequency of ≥50 GHz, wherein the resin material has a coefficient of water absorption of ≤0.01% and a coefficient of thermal expansion of ≤7×10-5, and comprises an amorphous synthetic resin. The circuit member is molded by using the resin material.