Title:
ディップ成形用組成物及びディップ成形体
Document Type and Number:
Japanese Patent JP5488137
Kind Code:
B2
Inventors:
Osamu Kobayashi
Yuki Emori
Yuki Emori
Application Number:
JP2010087472A
Publication Date:
May 14, 2014
Filing Date:
April 06, 2010
Export Citation:
Assignee:
Zeon Corporation
International Classes:
C08L9/10; A41D19/00; A61B19/04; A61F6/04; A61F7/10; A61J11/00; A61L29/00; A63H3/06; A63H27/10; B42D9/04; C08K3/06; C08K3/22; C08K5/39; C08L25/00
Domestic Patent References:
| JP2004532752A |
Attorney, Agent or Firm:
Yukio Uchida
Yasuro Wada
Yasuro Wada