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Title:
DUAL CURE EPOXY BACKSEAL FORMULATION
Document Type and Number:
Japanese Patent JPH04234422
Kind Code:
A
Abstract:

PURPOSE: To obtain a photocopolymerizable compsn. for backsealing a ceramic carrier and a process for using the same.

CONSTITUTION: This compsn. comprises a liq. multifunctional bisphenol-based epoxy (in a ratio to hydroxyl of 4-9), a liq. multifunctional hydroxyl-contg. org. material, a complex onium salt photoinitiator, and a complex cupric salt initiator. The compsn. utilizes, for deep curing, an exposure to a radiation energy and a strong Broensted acid completely supplied and produced by heating.


Inventors:
JIYURIO EMU ARUBARAADO
KASURIIN ERU KABAATO
JIYOZEFU PII KUTSUINSUKII
Application Number:
JP18463491A
Publication Date:
August 24, 1992
Filing Date:
July 24, 1991
Export Citation:
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Assignee:
IBM
International Classes:
C08F2/46; C08G59/00; C08G59/18; C08G59/24; C08G59/62; C08G59/68; C08L63/00; H01L23/14; H01L23/29; (IPC1-7): C08G59/18; C08G59/68
Domestic Patent References:
JPS5626927A1981-03-16
JPS6147727A1986-03-08
Attorney, Agent or Firm:
Kiyoshi Goda (4 outside)