Title:
ELECTRICAL CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2005223057
Kind Code:
A
Abstract:
To provide an electrical connection structure improving an adhesive strength, without increasing the electrical connection resistance.
In the electrical connection structure, a first electrical structure 1 and a second electrical structure 5 are connected electrically, by a conductive adhesive containing a silicone resin and a conductive filler. The electrical connection structure is formed, in which at least one electrode surfaces of first electrodes 2 formed to the first electrical structure 1 and second electrodes 4 formed to the second electrical structure 5 are, composed of surfaces consisting of precious metals and surfaces consisting of a metal oxide film.
Inventors:
SANO TAKESHI
YOSHIDA YOSHIHIRO
OKURA HIDEAKI
KOBAYASHI HIROSHI
YOSHIDA YOSHIHIRO
OKURA HIDEAKI
KOBAYASHI HIROSHI
Application Number:
JP2004028089A
Publication Date:
August 18, 2005
Filing Date:
February 04, 2004
Export Citation:
Assignee:
RICOH KK
International Classes:
H01R4/04; H01L21/60; H05K3/32; (IPC1-7): H05K3/32; H01L21/60; H01R4/04
Attorney, Agent or Firm:
Hideo Takino
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