Title:
WIRING BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2005223066
Kind Code:
A
Abstract:
To provide a wiring board having high reliability and to provide a method of manufacturing the same.
The wiring board includes a wiring pattern 10 including branched wiring 20, a conductive layer 30, and an insulating layer 40 disposed between the wiring pattern 10 and the conductive layer 30. The branched wiring 20 includes a first part 22, and two or more second parts 24 extended from the first part 22. The first part 22 is formed thicker than the second part 24.
Inventors:
HAGIO YOSHITOMO
KUROSAWA HIROFUMI
KUROSAWA HIROFUMI
Application Number:
JP2004028122A
Publication Date:
August 18, 2005
Filing Date:
February 04, 2004
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B05D5/12; H05K1/02; H05K3/10; (IPC1-7): H05K1/02; B05D5/12; H05K3/10
Attorney, Agent or Firm:
Inoue Ichi
Yukio Fuse
Mitsue Obuchi
Yukio Fuse
Mitsue Obuchi
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