To prepare an electrically conductive adhesive for directly connecting electrodes of semiconductor chips or electronic components or for directly connecting electrodes of electronic components containing semiconductor chips or semiconductor packages, and a wiring board having an excellent connection reliability by connecting conductor patterns and electrodes of electronic components using this electrically conductive adhesive.
This electrically conductive adhesive comprises, based on 100 pts.wt. epoxy resin, from 100 to 400 pts.wt. epoxy group-containing acrylic copolymer containing from 1 to 6 wt.% glycidyl (meth)acrylate and/or from 50 to 1,000 pts.wt. polyamide imide copolymer containing from 20 to 80 wt.% polysiloxane and from 200 to 1,000 pts.wt. metal particle. In a wiring board, a conductor pattern is connected with electrodes of an electronic component using this electrically conductive adhesive.
INADA TEIICHI
TANAKA HIROKO
TAKEUCHI KAZUMASA
SAITO TETSUYA
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