ELECTRODEPOSITION GRINDSTONE - MITSUBISHI MATERIALS CORP

Title:

ELECTRODEPOSITION GRINDSTONE

Document Type and Number:

Japanese Patent JP2001071269

Kind Code:

A

Abstract:

To improve sharpness and dischargeability of chips when grinding.

In this grindstone, nearly cylindrical protuberance parts are formed in a center area on one surface of a base metal 19 in a nearly lattice state. An abrasive grain layer 22 is formed on one surface, and plural super abrasive grains are fixed on only the respective protuberance parts by a metal plating phase to form protrusion parts 24. The protrusion part 24 has a height H above a mean grain diameter of the super abrasive grains from an abrasive grain layer bottom part 22a, and has a diameter D of 1-10 mm. The protuberance part of the protrusion part 24 has a corner R part and a top part. The corner R part and the top part are provided with the super abrasive grains. The number of the super abrasive grains provided on each the protrusion part 24 is set to 11-500, while a percentage of an occupying area of the super abrasive grains to the whole area of the abrasive grain layer 22 in a plan view is set to 20-80%.

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Inventors:

YAMASHITA TETSUJI
SHITAMAE NAOKI
HATA HANAKO

Application Number:

JP24767799A

Publication Date:

March 21, 2001

Filing Date:

September 01, 1999

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP

International Classes:

B24B53/017; B24D3/00; B24D3/06; B24D7/00; H01L21/304; (IPC1-7): B24D3/06; B24B37/00; H01L21/304

Attorney, Agent or Firm:

Masatake Shiga (7 outside)

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