Title:
無電解ニッケルめっき液及び無電解ニッケルめっき方法
Document Type and Number:
Japanese Patent JP7157435
Kind Code:
B2
Abstract:
To provide an electroless nickel plating solution capable of forming a nickel plating film excellent in bending resistance, and excellent in nickel plating deposition rate.SOLUTION: The electroless nickel plating solution includes an alkylene amine compound represented by the following general formula (I) [where, R, R, Rand Rare the same or different and are a hydrogen atom, a straight or branched chain alkyl group having 1-5 carbon atoms or a group shown by the following general formula (II) (where, Ris a straight or branched chain alkylene group having 1-5 carbon atoms); at least one selected from the group consisting of R, R, Rand Ris the group shown by the general formula (II) and may combine with each other to be cyclic; and n is an integer of 2-5.].SELECTED DRAWING: None
Inventors:
Yuki Tsuno
Eri Kajiyama
Yoshi Hashizume
Toshiya Murata
Eri Kajiyama
Yoshi Hashizume
Toshiya Murata
Application Number:
JP2018093319A
Publication Date:
October 20, 2022
Filing Date:
May 14, 2018
Export Citation:
Assignee:
Okuno Pharmaceutical Co., Ltd.
International Classes:
C23C18/36; C23C18/52; H05K3/18
Domestic Patent References:
| JP58199887A | ||||
| JP60036353A | ||||
| JP58019468A | ||||
| JP9049085A |
Attorney, Agent or Firm:
Saegusa International Patent Office