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Title:
ELECTROMAGNETIC INTERFERENCE SUPPRESSION BODY
Document Type and Number:
Japanese Patent JP2001057496
Kind Code:
A
Abstract:

To improve electromagnetic wave absorption characteristics, and to improve heat resistance at low costs while providing sufficient mechanical strength by providing heat-resistant resin at one or entire part of the surface of a composite magnetic material being used as a core.

In a composite magnetic material 1 being used as the core of an electromagnetic interference suppression body 11, flat or needle-shaped soft magnetic body powder and a resin matenal of an organic bonding agent are prepared by specific weight ratio and a creation method. Also, silicon resin is used as heat-resistant resin 5 for covering a surface. The thickness of the composite magnetic material 1 being used as the core and the heat-resistant resin layer 5 should be set to 1 and 0.5 mm, respectively. In such electromagnetic interference suppression body 11, excellent characteristics are obtained. Also, although the heat-resistant temperature of the composite magnetic matenal of a conventional electromagnetic interference suppression body 11 was 85°C, the heat-resistant temperature can be increased up to 120°C in the electromagnetic interference suppression body 11. Furthermore, a material and a process required for preparing the electromagnetic interference suppression body are not special, so that cost increase is slight.


Inventors:
KAMEI KOJI
Application Number:
JP23228599A
Publication Date:
February 27, 2001
Filing Date:
August 19, 1999
Export Citation:
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Assignee:
TOKIN CORP
International Classes:
H01F1/00; H01Q17/00; H05K9/00; (IPC1-7): H05K9/00; H01F1/00; H01Q17/00



 
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