Title:
ELECTROMAGNETIC PUMP TYPE SOLDERING DEVICE
Document Type and Number:
Japanese Patent JP3725675
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To efficiently cool act induction coils used for the electromagnetic pump type soldering device as a whole.
SOLUTION: An electromagnetic pump 47 is arranged along a solder bath 33. an a primary side of the electromagnetic pump 47, a primary iron core 52 is brought into close contact with an outside surface of the soldering bath 33 through a thin heat insulation material 100, induction coils 51 are respectively wound around plural coil mounting recessed grooves 55 of the primary iron core 52, cooling pipes 101 receiving cooling air supply are respectively inserted between the induction coils 51 in the respective coil mounting grooves 55. Thick heat insulation materials 102 are interposed between the induction coils 51 in the respective mounting recessed grooves 55 and the solder bath 33. The cooling pipe 101 in the respective coil mounting recessed grooves 55 is connected to a cooling fan 104 through a common box body 103.
Inventors:
Niki Masuda
Junichi Onozaki
Koji Saito
Junichi Onozaki
Koji Saito
Application Number:
JP26363597A
Publication Date:
December 14, 2005
Filing Date:
September 29, 1997
Export Citation:
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
International Classes:
B23K3/06; B23K1/08; H02K44/06; H05K3/34; (IPC1-7): B23K1/08; H02K44/06; H05K3/34
Domestic Patent References:
| JP59005392B2 |
Attorney, Agent or Firm:
樺澤 襄
Shimamune Masami
Satoshi Kabazawa
Shimamune Masami
Satoshi Kabazawa