Title:
ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2010251780
Kind Code:
A
Abstract:
To provide an electronic apparatus for improving cooling efficiency.
The electronic apparatus provided with housing for accommodating a heating element includes a housing, a circuit board 11 accommodated in the housing, a surface mounting component 21 mounted on the circuit board 11, a heat generating component 22b mounted on the circuit board, a reinforcing member 27 having heat conducting property and reinforcing an region on the circuit board 11 where the surface mounting component 21 is mounted, and a heat dissipation unit extended from the reinforcing member 27 and thermally connected to the heat generating component 22b.
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Inventors:
OKUTSU ISAO
Application Number:
JP2010133463A
Publication Date:
November 04, 2010
Filing Date:
June 11, 2010
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H05K7/20; H01L23/40; H01L23/427
Domestic Patent References:
| JP2008010768A | 2008-01-17 | |||
| JPH10303582A | 1998-11-13 | |||
| JP2004356492A | 2004-12-16 | |||
| JP2008294348A | 2008-12-04 | |||
| JP2008251687A | 2008-10-16 | |||
| JP2008010768A | 2008-01-17 | |||
| JPH10303582A | 1998-11-13 | |||
| JP2004356492A | 2004-12-16 |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office