To provide an electronic circuit apparatus which can detect the temperature of a semiconductor element accurately in connection with the electronic circuit apparatus which detects the temperature of a semiconductor element and controls to protect by mounting the semiconductor element, such as an IPM (intelligent power module) used for an inverter control apparatus etc. on a circuit substrate.
A printed circuit board consists of a vertical type sub substrate 108 and a main substrate 126. The semiconductor element 104 and the temperature sensor 116 are mounted in the vertical type sub substrate 108. The heat sink plate 118 which radiates heat generated from the semiconductor element 104 is arranged so that the vertical sub substrate 108, the temperature sensor 116 and the semiconductor element 104 may be enclosed. A potting material 122 is filled up so that the vertical type sub substrate 108, the temperature sensor 116, and the semiconductor element 104 may be covered inside the heat sink plate 118. Thereby, the temperature gradient of the semiconductor element 104 and the temperature sensor 116 can be reduced, and the temperature of the semiconductor element 104 can be detected accurately.
Tomoyasu Sakaguchi
Hiroki Naito
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