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Title:
ELECTRONIC COMPONENT MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP2717078
Kind Code:
B2
Abstract:

PURPOSE: To provide an electronic component mounting device, which can mount an electronic component on a printed board accurately and efficiently.
CONSTITUTION: A plurality of suction heads 70 are held by a support means comprising an intermittent rotary table 58 and a cam 66 at equal-angle intervals and each suction head 90 is moved in order to a component receiving position, an attitude detection position, an attitude changing position and a component mounting position. While the receipt of the electronic component and the mounting of the electronic component on a printed board are conducted at the component receiving position and the component mounting position, the holding attitudes of the components being held by the heads 70 are detected by imaging the attitudes at the attitude detection position, a driving rotator is made to engage with a rotator to be driven formed integrally with the heads 70 in a concentric and rotation transmittable manner at the attitude changing position and the heads 70 are rotated to change the attitudes of the components. The rotation of the heads 70 is normally prevented by a brake device, but the rotation of the heads 70 using the driving rotator is allowed by this brake device.


Inventors:
Asai Hoichi
Mamoru Tsuda
Yasuo Muto
Application Number:
JP23818895A
Publication Date:
February 18, 1998
Filing Date:
September 18, 1995
Export Citation:
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Assignee:
Fuji Machine Manufacturing Co., Ltd.
International Classes:
B23P19/00; B23P21/00; H05K13/00; H05K13/04; H05K13/08; (IPC1-7): H05K13/04; B23P21/00
Domestic Patent References:
JP59155200A
JP5984499A
JP6028298A
JP6163096A
Attorney, Agent or Firm:
Norikazu Kobe (2 outside)