Title:
電子部品搭載用パッケージ、電子装置および電子モジュール
Document Type and Number:
Japanese Patent JP7021937
Kind Code:
B2
Abstract:
To provide a package for mounting an electronic component, an electronic device having high luminance, and an electronic module.SOLUTION: A package 1 for mounting an electronic component comprises: an insulating substrate 11 that has a first principal surface 11a and a second principal surface 11b facing the first principal surface 11a in a thickness direction, and includes a concave part opening to the first principal surface 11a; and a metal layer 13 that is located on the side face of the concave part 11c, and includes a projection part 13a projecting from the side face of the concave part 11c.SELECTED DRAWING: Figure 2
Inventors:
Itakura Yoshitetsu
Akihiko Kitagawa
Akihiko Kitagawa
Application Number:
JP2017249578A
Publication Date:
February 17, 2022
Filing Date:
December 26, 2017
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L33/62; H01L23/12; H05K1/02; H05K1/18
Domestic Patent References:
| JP2004327504A | ||||
| JP2005019919A | ||||
| JP2006165491A |
Foreign References:
| WO2016136733A1 | ||||
| WO2015016048A1 |
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune
Yoshio Arafune
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