Title:
ELECTRONIC COMPONENT PROTECTING DEVICE AND METHOD FOR DETECTING REFORM OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3497433
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component protecting device, where the electromagnetic wave noise surge is coped with by post-fitting after manufacture.
SOLUTION: A semiconductor package type electronic component 30 soldered to a printed board 20 is protected from the electromagnetic wave noise. Here, a protective sheet 60 attached to the surface opposite to the surface of printed board 20, where the electronic component 30 is attached, a hole 64 which is provided on the protective sheet 60 and engages with a lead 30a of the electronic component 30, a copper foil pattern 62 making electrical contact with the lead 30a formed in the hole 64, and a chip-type electronic component 63 which is connected via the copper foil pattern 62 and mounted on the protective sheet, are provided.
Inventors:
Yusuke Uekusa
Taro Mimatsu
Taro Mimatsu
Application Number:
JP2000004075A
Publication Date:
February 16, 2004
Filing Date:
January 12, 2000
Export Citation:
Assignee:
Cotovale Co., Ltd.
NTT Advanced Technology Corporation
NTT Advanced Technology Corporation
International Classes:
A63F7/02; H05K1/14; H05K1/18; H05K9/00; (IPC1-7): H05K1/18; A63F7/02; H05K1/14; H05K9/00
Domestic Patent References:
| JP11197291A | ||||
| JP4830365U | ||||
| JP1179462U | ||||
| JP1133767U |
Attorney, Agent or Firm:
Masatake Shiga (7 outside)