To accurately align an IC package and an IC socket even for downsizing and high density of the IC package, in an electronic device provided with the IC package formed by packaging a lead frame with a resin and the IC socket connected to the lead frame of the IC package.
The electronic device S1 is formed by connecting an IC socket 200 to a lead frame 10 of an IC package 100 that the lead frame 10 is packaged by a resin 20. In this case, a part of the lead frame 10 is exposed over the resin 20 in the package land surface 101 of the IC package 100, and a recess 13 is formed in the exposed section. A projection 230 is provided in the opposite region to the recess 13 of the lead frame 10 in the IC socket 200, and its shape corresponds to the shape of the recess 13, and the recess 13 and the projection 230 are engaged with each other, resulting in permitting positioning of the IC package and the IC socket.
ASAI SHOKI
OTA SHINJI
Takahiro Miura
Fumihiro Mizuno
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