PURPOSE: To avoid the needless radiation by a method wherein the title electronic part is provided with a semiconductor chip of an integrated circuit, shield plates arranged as if covering the semiconductor chip and the material molding the semiconductor chip and the shield plates formed into one body.

CONSTITUTION: A part 5a corresponding to the ground pin of a lead frame 13 and a lower side shield plate 9 are connected to each other by welding step so as to form the lead frame 13 and the lower side shield plate 9 into one body. Next, an LSI semiconductor chip 7 is mounted on a semiconductor chip stage 6 on the central part. Later, the connecting terminals 7b of the LSI semiconductor chip 7 and the connecting parts 13b of the lead frame 13 are connected to one another by bonding lead wires 8. Furthermore, an upper side Shield plate 10 is connected to said part 5a by welding step again. Next, the whole body is molded in a resin 12. Finally, the lead frame 13 is cut off to be a pin as inlet and outlet.