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Patent Searching and Data


Title:
ELECTRONIC PARTS WITH LEAD
Document Type and Number:
Japanese Patent JPH05222472
Kind Code:
A
Abstract:

PURPOSE: To provide the electronic parts with leads which minimizes the generation of an appearance defect and disconnection, etc., on the external lead terminals to be fitted to a metallized wiring layer deposited on an insulating base body by uniformly forming and depositing a plating metallic layer over the entire surface on the exposed outside surface of the external lead terminals.

CONSTITUTION: The external lead terminals 7 of the electronic parts with the leads constituted by mounting the external lead terminals 7 via brazing filler metals 8 to the metallized wiring layer 5 deposited on the insulating base body 1 are formed of a metal essentially consisting of a copper-nickel alloy contg. 0.5 to 30.0wt.% nickel and the balance copper or the metal formed by substituting ≤2.0wt.% of the copper of the copper-nickel alloy with at least one kind among iron, manganese and zinc.


Inventors:
HOSOI YOSHIHIRO
NISHIDA MOTOI
Application Number:
JP2863092A
Publication Date:
August 31, 1993
Filing Date:
February 15, 1992
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
C22C9/00; H01L23/48; (IPC1-7): C22C9/00; H01L23/48