ELECTRONIC SUBSTRATE POSITIONING DEVICE, ELECTRONIC SUBSTRATE POSITIONING METHOD, RECORDING DEVICE, AND LIQUID EJECTION DEVICE

Title:

ELECTRONIC SUBSTRATE POSITIONING DEVICE, ELECTRONIC SUBSTRATE POSITIONING METHOD, RECORDING DEVICE, AND LIQUID EJECTION DEVICE

Document Type and Number:

Japanese Patent JP2006007731

Kind Code:

A

Abstract:

To enable anyone to readily and reliably attach an electronic substrate, and to prevent breakage, poor contact, etc. of the electronic substrate caused upon attachment of the electronic substrate.

A part of the lower side of the electronic substrate 30 is extended to form a protrusion so as to provide an engaging protruding part 32. A receiving reentrant part 33 which is engaged with the engaging protruding part and receives the electronic substrate in a comparative looseness without strict positioning is provided. In the receiving reentrant part, a pressure welding connector 34 for establishing conduction by pressure-welding the electronic substrate in the back side is provided. A spacer 31 is provided as a means for pressure-welding the electronic substrate.

Inventors:

HARADA KAZUMASA
FURUYAMA MASASHI
NAKAJIMA HIROO

Application Number:

JP2004192122A

Publication Date:

January 12, 2006

Filing Date:

June 29, 2004

Export Citation:

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Assignee:

SEIKO EPSON CORP

International Classes:

B41J29/00; B41J2/01

Domestic Patent References:

JPH0725112A	1995-01-27
JP2003011390A	2003-01-15
JP2000211144A	2000-08-02
JPH0725112A	1995-01-27
JP2003011390A	2003-01-15
JP2000211144A	2000-08-02

Attorney, Agent or Firm:

Hiroki Ishii

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