Title:
ELECTROPLATING OF ALUMINUM AND ALUMINUM ALLOY PLATE
Document Type and Number:
Japanese Patent JPH06146073
Kind Code:
A
Abstract:
PURPOSE: To electrodeposit a plating film having good adhesion on an aluminum or aluminum alloy plate with good productivity.
CONSTITUTION: Electroplating is executed by using a plating liquid in which fluorine is dissolved. The amt. of the fluorine is controlled to ≥0.01mol/l and to a concn. of ≥3 times the concn. of the aluminum dissolved in the plating liquid. Further, the relative flow velocity of the plating liquid is controlled to ≥0.2m/sec and the local concentrating of the aluminum ions is preferably prevented by well stirring the plating bath during the operation. As a result, the plating film having the good adhesion is stably obtd. without degrading the adhesion even if the plating bath is repetitively used.
Inventors:
KOIKE TETSUHIRO
YAMANAKA YOICHIRO
YOMURA YOSHINORI
YAMANAKA YOICHIRO
YOMURA YOSHINORI
Application Number:
JP30512092A
Publication Date:
May 27, 1994
Filing Date:
November 16, 1992
Export Citation:
Assignee:
NIPPON KOKAN KK
International Classes:
C25D3/44; C25D5/30; C25D5/44; C25D21/14; (IPC1-7): C25D5/30; C25D3/44; C25D21/14
Previous Patent: A liquid crystal constituent and a liquid crystal display element
Next Patent: WHOLLY PLATING DEVICE
Next Patent: WHOLLY PLATING DEVICE