To provide an electroplating method by which the desired plating thickness and plating thickness distribution can easily be obtained, and a shielding plate used in the method.

In this electroplating method, the shielding plate which has plural pieces of current-carrying pores is arranged between objects to be plated and an anode and the current-carrying pores are selectively clogged so as to obtain the desired plating thickness or the plating thickness distribution of the plating film. In this shielding plate used in the electroplating method, the plural pieces of the current-carrying pores for controlling the film thickness of plating film are formed, the pores are clogged as need and the desired plating thickness and the plating thickness distribution can be obtained.