Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ENDOSCOPE APPARATUS
Document Type and Number:
Japanese Patent JP2005152461
Kind Code:
A
Abstract:

To provide an endoscope whose parts are jointed and fixed with a durable adhesive free from softening degradation, hardening degradation, brittle fracture, a lowering of bonding strength, and the like caused by oxidative degradation, hydrolysis and heat even by various disinfecting methods.

The parts constituting the endoscope are jointed with a three component reactive adhesive comprising a main agent in which 5-15 wt.% of a rubber and/or a plastic is added to an epoxy resin, an amine curing agent mixed with a mix ratio of 10:1-10:4 to the main agent, and 0.1-1% pts.wt. thermal cationic curing initiator.


Inventors:
KAGAWA ICHIRO
MATSUMOTO JUN
Application Number:
JP2003398149A
Publication Date:
June 16, 2005
Filing Date:
November 27, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OLYMPUS CORP
International Classes:
G02B23/24; A61B1/00; (IPC1-7): A61B1/00; G02B23/24
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Sadao Muramatsu
Tetsuya Kazama