Title:
EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT AND COMPOSITE MATERIAL
Document Type and Number:
Japanese Patent JP2023099224
Kind Code:
A
Abstract:
To provide an epoxy resin that can simplify the production process of a fiber-reinforced composite material, and an epoxy resin composition, an epoxy resin cured product and a composite material each of which employs the epoxy resin.SOLUTION: An epoxy resin includes an epoxy compound having a mesogenic structure, a cured product of the epoxy resin having a flexural modulus of 3.0 GPa or more at 23°C, a fracture toughness of 1.0 MPa m1/2 or more, and a glass transition temperature of 150°C or higher.SELECTED DRAWING: None
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Inventors:
MARUYAMA NAOKI
TONAI TOMOKO
FUKUDA KAZUMASA
KATAKI HIDEYUKI
NAKAMURA YUKI
TAKEZAWA YOSHITAKA
TONAI TOMOKO
FUKUDA KAZUMASA
KATAKI HIDEYUKI
NAKAMURA YUKI
TAKEZAWA YOSHITAKA
Application Number:
JP2023079609A
Publication Date:
July 11, 2023
Filing Date:
May 12, 2023
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
C08G59/24
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office