EPOXY RESIN COMPOSITION, ITS CURED ITEM, AND SEMICONDUCTOR DEVICE USING IT

Title:

EPOXY RESIN COMPOSITION, ITS CURED ITEM, AND SEMICONDUCTOR DEVICE USING IT

Document Type and Number:

Japanese Patent JPH08283536

Kind Code:

A

Abstract:

PURPOSE: To obtain an epoxy resin compsn. which is excellent in heat resistance, moisture resistance, mechanical strengths, and oxidation resistance and improved in electrical reliability by compounding a polyepoxy resin with a specific phenol- aralkyl resin.

CONSTITUTION: A polyepoxy resin is compounded with a phenol-aralkyl resin in a molar ratio of active hydrogen atoms of the latter resin to epoxy groups of the former resin of 0.75-1.2. The phenol-aralkyl resin is obtd. by reacting 1.3-15mol of a phenol compd. of the formula (wherein R1 and R2 are each H, 1-9C alkyl, 1-4C alkoxy, phenyl, halogen, or hydroxyl) with 1mol of a bishalogenomethyl compd. of the formula: R3CH2X (wherein R3 is phenylene, alkylated phenylene, biphenylene, a divalent diphenyl ether residue, or naphthylene; and X is a halogen).

Inventors:

URAGAMI TATSUNOBU
ISHIDA TSUTOMU
TAKUMA HIROSUKE

Application Number:

JP9257495A

Publication Date:

October 29, 1996

Filing Date:

April 18, 1995

Export Citation:

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Assignee:

MITSUI TOATSU CHEMICALS

International Classes:

C08L63/00; C08G59/20; C08G61/00; C08L65/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/20; C08G61/00; C08L65/00; H01L23/29; H01L23/31

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