Title:
EPOXY RESIN COMPOSITION AND PREPREG USING THE SAME, AND FIBER-REINFORCED COMPOSITE RESIN MOLDING PRODUCED FROM THE PREPREG
Document Type and Number:
Japanese Patent JP2013159696
Kind Code:
A
Abstract:
To provide an epoxy resin composition capable of obtaining a fiber-reinforced composite resin molding whose curing is completed in a short time even at a low temperature and which has excellent mechanical properties, in particular fracture toughness when used as a matrix resin of a prepreg, a prepreg using the epoxy resin composition, and a fiber-reinforced composite resin molding formed from the prepreg.
An epoxy resin composition comprises the following components (A), (B), (C), and (D): (A) an epoxy resin having at least one sulfur atom in a molecule; (B) a bisphenol type epoxy resin of a molecular weight of 500-1,100; (C) a polyamide compound soluble in the epoxy resin; and (D) a curing agent.
Inventors:
FUKUHARA YASUHIRO
ISHIMOTO TOMOKO
KANEKO MANABU
ISHIMOTO TOMOKO
KANEKO MANABU
Application Number:
JP2012022424A
Publication Date:
August 19, 2013
Filing Date:
February 03, 2012
Export Citation:
Assignee:
MITSUBISHI RAYON CO
International Classes:
C08G59/44; C08J5/24; C08K5/16; C08L63/00; C08L77/12
Domestic Patent References:
| JPH01287130A | 1989-11-17 | |||
| JPS6143617A | 1986-03-03 | |||
| JPS6337137A | 1988-02-17 | |||
| JPS6189223A | 1986-05-07 | |||
| JPH09316302A | 1997-12-09 | |||
| JPH06166765A | 1994-06-14 |
Foreign References:
| WO2010023918A1 | 2010-03-04 | |||
| WO1996002592A1 | 1996-02-01 |