Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2001072832
Kind Code:
A
Abstract:
To obtain an epoxy resin composition not causing failure of current conduction of a semiconductor element in a semiconductor device having mainly a Lead On Chip(LOC) structure which is the main current of memory package.
This epoxy resin composition for LOC structure comprises an epoxy resin, a phenol resin, a curing accelerator and inorganic filler having smaller maximum particle diameter than a thickness of LOC tape after joining a semiconductor element to a lead frame as main components, and compounding amount of the inorganic filler is 75-95 wt.% based on total resin composition.
Inventors:
FUJITA HIROSHI
Application Number:
JP25160199A
Publication Date:
March 21, 2001
Filing Date:
September 06, 1999
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L63/00; C08G59/62; C08K7/18; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/62; C08K7/18; H01L23/29